Computational Study of the Thermodynamic Properties of Some Lead-free Solder Alloys

Activities of the components binary lead-free solder alloys Cu-Sn, and Ag-Cu were computed using molecular interaction volume model (MIVM). The theoretical data have been compared with corresponding experimental values. For validity parameters, excess Gibbs free energy mixing liquid determined available in literature. Similarly, activities Sn ternary Sn-Ag-Cu examined at 1000 K. It has observed that calculated nearly same tendency as data.